Dual junction GaInP/GaAs solar cells grown on metamorphic SiGe/Si substrates with high open circuit voltage

Matthew Lueck, C. Andre, Arthur J. Pitera, +3

IEEE Electron Device Letters

Electrical EngineeringEngineeringMetamorphic Sige/siApplied PhysicsSige Metamorphic Buffers +10

Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration

Alan Huffman, John Lannon, Matthew Lueck, +2

Journal of Instrumentation

Electrical ResistanceEngineeringDevice IntegrationInterconnect (Integrated Circuits)Bump Structures +17

High Density Metal–Metal Interconnect Bonding for 3-D Integration

John M. Lannon, Chris Gregory, Matthew Lueck, +3

IEEE Transactions on Components Packaging and Manufacturing Technology

EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Wafer Scale ProcessingDevice Layers +15

Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs

Dean Malta, Christopher W. Gregory, Matthew Lueck, +6

Through glass vias (TGV) and aspects of reliability

Matthew Lueck, Alan Huffman, Aric Shorey

EngineeringChemical CompositionMechanical EngineeringIntegrated CircuitsInterconnect (Integrated Circuits) +20

High-Density Large-Area-Array Interconnects Formed by Low-Temperature Cu/Sn–Cu Bonding for Three-Dimensional Integrated Circuits

Matthew Lueck, Jason D. Reed, Christopher W. Gregory, +3

IEEE Transactions on Electron Devices

EngineeringArea ArraysIntegrated CircuitsInterconnect (Integrated Circuits)Wafer Scale Processing +16

High density interconnect at 10µm pitch with mechanically keyed Cu/Sn-Cu and Cu-Cu bonding for 3-D integration

Jason D. Reed, Matthew Lueck, Chris Gregory, +3

EngineeringDevice IntegrationMechanical EngineeringCu-cu BondingInterconnect (Integrated Circuits) +17

Effects of Assembly Process Parameters on the Structure and Thermal Stability of Sn-Capped Cu Bump Bonds

Alan Huffman, Matthew Lueck, Christopher A. Bower, +1

Supramolecular AssemblyEngineeringMechanical EngineeringInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors) +16

High density Cu-Cu interconnect bonding for 3-D integration

John Lannon, Christopher W. Gregory, Matthew Lueck, +2

EngineeringIntegrated CircuitsSmall Pitch ScalingInterconnect (Integrated Circuits)Wafer Scale Processing +17

Microfabrication of diamond-based slow-wave circuits for mm-wave and THz vacuum electronic sources

Matthew Lueck, Dean Malta, Kristin H. Gilchrist, +3

Journal of Micromechanics and Microengineering

Thz PhotonicsTerahertz TechnologyEngineeringOscillatorsThz Radiation Sources +17