John M. Lannon

High Density Metal–Metal Interconnect Bonding for 3-D Integration

John M. Lannon, Chris Gregory, Matthew Lueck et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 34 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +17

High-Density Large-Area-Array Interconnects Formed by Low-Temperature Cu/Sn–Cu Bonding for Three-Dimensional Integrated Circuits

Matthew Lueck, Jason D. Reed, Christopher W. Gregory et al. · IEEE Transactions on Electron Devices · 2012 · 32 citations

Engineering, Area Arrays, Integrated Circuits +18

High density interconnect at 10µm pitch with mechanically keyed Cu/Sn-Cu and Cu-Cu bonding for 3-D integration

Jason D. Reed, Matthew Lueck, Chris Gregory et al. · 2010 · 32 citations

Engineering, Device Integration, Mechanical Engineering +19

Stoichiometry, morphology and structure of CdS layers grown on InP(100) from atomic sulfur beam generated from H2S gas and thermally evaporated Cd using molecular beam epitaxy

Joo Won Choi, A. Bhupathiraju, M. Arif Hasan et al. · Journal of Crystal Growth · 2003 · 20 citations

Materials Science, Ii-vi Semiconductor, Engineering +6

Hydrogen ion interactions with silicon carbide and the nucleation of diamond thin films

John M. Lannon, J. S. Gold, C.D. Stinespring · Journal of Applied Physics · 1995 · 17 citations

Engineering, Silicon Carbide, Vacuum Device +17