A mechanism for androgen receptor-mediated prostate cancer recurrence after androgen deprivation therapy.

Chris Gregory, Bin He, Raymond T. Johnson, +4

PubMed

Androgen ReceptorUrologyGenitourinary CancerMedicineHormonal Receptor +10

PbS colloidal quantum dot photodiodes for low-cost SWIR sensing

Ethan J. D. Klem, Chris Gregory, D. Temple, +1

Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

Planar PbS quantum dot/C60 heterojunction photovoltaic devices with 5.2% power conversion efficiency

Ethan J. D. Klem, Chris Gregory, G. Cunningham, +3

Applied Physics Letters

EngineeringOrganic Solar CellPhotovoltaic DevicesPlasmon-enhanced PhotovoltaicsPhotovoltaic System +15

High Density Metal–Metal Interconnect Bonding for 3-D Integration

John M. Lannon, Chris Gregory, Matthew Lueck, +3

IEEE Transactions on Components Packaging and Manufacturing Technology

EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Wafer Scale ProcessingDevice Layers +15

High density interconnect at 10µm pitch with mechanically keyed Cu/Sn-Cu and Cu-Cu bonding for 3-D integration

Jason D. Reed, Matthew Lueck, Chris Gregory, +3

EngineeringDevice IntegrationMechanical EngineeringCu-cu BondingInterconnect (Integrated Circuits) +17

The novel Ras antagonist, farnesylthiosalicylate, suppresses growth of prostate cancer in vitro

R. A. McPherson, Mark Conaway, Chris Gregory, +2

The Prostate

10D-1 On-Line Ultrasonic Inspection at Elevated Temperatures

Stephen Kelly, Ian Atkinson, Chris Gregory, +1

Proceedings/Proceedings - IEEE Ultrasonics Symposium

Real-time MonitoringEngineeringInspectionEnvironmental MonitoringIndustrial Engineering +19

3D and 2.5D packaging assembly with highly silica filled One Step Chip Attach Materials for both thermal compression bonding and mass reflow processes

Daniel Duffy, Chris Gregory, C.D. Breach, +1

Packaging AssemblyEngineeringMechanical EngineeringThermal Compression BondingAdvanced Packaging (Semiconductors) +16

Ultrasmart: Developments in Ultrasonic Flaw Detection and Monitoring for High Temperature Plant Applications

Ian Atkinson, Chris Gregory, Stephen Kelly, +1

EngineeringIndustrial EngineeringWell DiagnosticsMechanical EngineeringSmart Manufacturing +19

Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization

John Lannon, Allan Hilton, Alan Huffman, +4

IEEE Transactions on Components Packaging and Manufacturing Technology

EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Backside MlmWafer Scale Processing +20