Statistics
Publications
20
Citations
414
H-Index
13
Active since
2005
John Lannon is an author at RTI International specializing in semiconductor devices, electrical engineering, and engineering.
Publications per year
2005–2024
20
20
High density Cu-Cu interconnect bonding for 3-D integration
John Lannon, Christopher W. Gregory, Matthew Lueck et al. · 2009 · 27 citations
1–5 of 20