Microelectronics Reliability · 2021 · 23 citations · 29 references
Electrical EngineeringElectromigration TechniqueEngineeringReal-time ObservationIndustrial EngineeringMechanical EngineeringSolder JointsElectronic PackagingCross-sectioned Model System
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Stress evolution due to electromigration in confined metal lines
M. A. Korhonen, P. Bo rgesen, K. N. Tu et al. · Journal of Applied Physics · 1993 · 724 citations