Performance evaluation of noise coupling on Germanium based TSV filled material for future IC integration technique

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Engineering, Computer Engineering, Electrical Engineering +14

Bridging the Processor-Memory Performance Gapwith 3D IC Technology

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Engineering, Computer Engineering, Computer Science +17

Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review

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Engineering, Electrical Engineering, Materials Science +17

Interface and Reliability Analysis of Au-Passivated Cu–Cu Fine-Pitch Thermocompression Bonding for 3-D IC Applications

Satish Bonam, Asisa Kumar Panigrahi, C. Hemanth Kumar et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 69 citations

Natural Sciences, Materials Engineering, Materials Science +17

Ultra-thin Ti passivation mediated breakthrough in high quality Cu-Cu bonding at low temperature and pressure

Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh et al. · Materials Letters · 2016 · 66 citations

Natural Sciences, Materials Engineering, Materials Science +9