Asisa Kumar Panigrahi

Interface and Reliability Analysis of Au-Passivated Cu–Cu Fine-Pitch Thermocompression Bonding for 3-D IC Applications

Satish Bonam, Asisa Kumar Panigrahi, C. Hemanth Kumar et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 69 citations

Natural Sciences, Materials Engineering, Materials Science +17

Ultra-thin Ti passivation mediated breakthrough in high quality Cu-Cu bonding at low temperature and pressure

Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh et al. · Materials Letters · 2016 · 66 citations

Natural Sciences, Materials Engineering, Materials Science +9

A multi-walled carbon nanotube–zinc oxide nanofiber based flexible chemiresistive biosensor for malaria biomarker detection

Brince Paul K, Asisa Kumar Panigrahi, Vikrant Singh et al. · The Analyst · 2017 · 65 citations

Engineering, Bioengineering, Biomedical Engineering +17

Demonstration of sub 150 °C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer

Asisa Kumar Panigrahi, Tamal Ghosh, Siva Rama Krishna Vanjari et al. · Materials Letters · 2017 · 56 citations

Natural Sciences, Materials Engineering, Materials Science +17

Oxidation Resistive, CMOS Compatible Copper-Based Alloy Ultrathin Films as a Superior Passivation Mechanism for Achieving 150 °C Cu–Cu Wafer on Wafer Thermocompression Bonding

Asisa Kumar Panigrahi, Tamal Ghosh, Siva Rama Krishna Vanjari et al. · IEEE Transactions on Electron Devices · 2017 · 45 citations

Natural Sciences, Materials Engineering, Materials Science +17