Demonstration of sub 150 °C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer - Concepedia

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Demonstration of sub 150 °C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer

54

Citations

14

References

2017

Year

Asisa Kumar Panigrahi, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh

Materials Letters

Materials EngineeringMaterials ScienceSub 150EngineeringSurface ScienceApplied PhysicsHigh-performance MaterialManganin AlloyChemistryThin FilmsElectronic PackagingIc ApplicationsSurface Processing

References

	Year	Citations

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