Satish Bonam - Concepedia

Author

Satish Bonam

Indian Institute of Technology Hyderabad ORCID

Also Known As

S. Bonam, Satish Bonam

Publications

335

Citations

H-Index

Concepts

All Affiliations

Indian Institute of Technology Hyderabad

About

Satish Bonam is an author at Indian Institute of Technology Hyderabad specializing in engineering, applied physics, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	7	7	163
2	Applied Physics	6	6	147
3	Electrical Engineering	3	3	52
4	Chemical Engineering	1	1	16
5	Chemistry	1	1	16

Satish Bonam

Publications

252

Citations

H-Index

Page 1

	Year	Citations
Interface and Reliability Analysis of Au-Passivated Cu–Cu Fine-Pitch Thermocompression Bonding for 3-D IC Applications Satish Bonam, Asisa Kumar Panigrahi, C. Hemanth Kumar, IEEE Transactions on Components Packaging and Manufacturing Technology	2019	66
Ultra-thin Ti passivation mediated breakthrough in high quality Cu-Cu bonding at low temperature and pressure Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Materials Letters Materials ScienceMaterials EngineeringUltra-thin Ti PassivationMaterial AnalysisEngineering	2016	64
Low temperature, low pressure CMOS compatible Cu -Cu thermo-compression bonding with Ti passivation for 3D IC integration Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, EngineeringExcellent BondingIntegrated CircuitsInterconnect (Integrated Circuits)Low Temperature	2015	22
Flexible polymer-based triboelectric nanogenerator using Poly(vinylidene fluoride) and bombyx mori silk Lisa Sarkar, A.B. Kandala, Satish Bonam, Materials Today Sustainability Materials ScienceVinylidene FluorideElectroactive MaterialEngineeringNanoengineering	2022	22
Improved chemiresistor gas sensing response by optimizing the applied electric field and interdigitated electrode geometry Venkata Ramesh Naganaboina, Satish Bonam, Mariappan Anandkumar, Materials Chemistry and Physics Electrical EngineeringChemical EngineeringEngineeringGas SensorImproved Chemiresistor Gas	2023	16
Optimized ultra-thin manganin alloy passivated fine-pitch damascene compatible bump-less Cu–Cu bonding at sub 200 °C for three-dimensional Integration applications Asisa Kumar Panigrahi, C. Hemanth Kumar, Satish Bonam, Japanese Journal of Applied Physics Materials ScienceSurface CharacterizationEngineeringThree-dimensional Heterogeneous IntegrationSurface Science	2017	14
Metal-Alloy Cu Surface Passivation Leads to High Quality Fine-Pitch Bump-Less Cu-Cu Bonding for 3D IC and Heterogeneous Integration Applications Asisa Kumar Panigrahi, C. Hemanth Kumar, Satish Bonam, EngineeringHeterogeneous Integration ApplicationsCu Surface PassivationInterconnect (Integrated Circuits)Low Temperature	2018	14
An Ultra-Flexible Tactile Sensor Using Silk Piezoelectric Thin Film Satish Bonam, K. Aditya Bhagavathi, Jose Joseph, IEEE Sensors Journal	2023	12
High Quality Fine-Pitch Cu-Cu Wafer-on-Wafer Bonding with Optimized Ti Passivation at 160°C Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, EngineeringInterconnect (Integrated Circuits)Low TemperatureWafer Scale ProcessingAdvanced Packaging (Semiconductors)	2016	11
Humidity-Independent Methane Gas Detection in Gd<sub>0.2</sub>La<sub>0.2</sub>Ce<sub>0.2</sub>Hf<sub>0.2</sub>Zr<sub>0.2</sub>O₂-Based Sensor Using Polynomial Regression Analysis Venkata Ramesh Naganaboina, Satish Bonam, Mariappan Anandkumar, IEEE Electron Device Letters	2022	11

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