Low-temperature smoothing method of scalloped DRIE trench by post-dry etching process based on SF6 plasma - Concepedia

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Low-temperature smoothing method of scalloped DRIE trench by post-dry etching process based on SF6 plasma

DOI Full Paper Access

22

Citations

13

References

2020

Year

Jin Soo Park, Dong-Hyun Kang, Seung Min Kwak, Tae Song Kim, Jung Ho Park, Tae Geun Kim, Seung‐Hyub Baek, Byung Chul Lee

Micro and Nano Systems Letters

References

	Year	Citations

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