Low-temperature smoothing method of scalloped DRIE trench by post-dry etching process based on SF6 plasma

A survey on the reactive ion etching of silicon in microtechnology

Henri Jansen, Han Gardeniers, M. de Boer et al. · Journal of Micromechanics and Microengineering · 1996 · 464 citations · Full text

Engineering, Mechanical Engineering, Reactive Ion Etching +18

Effect of process parameters on the surface morphology and mechanical performance of silicon structures after deep reactive ion etching (DRIE)

Kuo‐Shen Chen, Arturo A. Ayón, Xin Zhang et al. · Journal of Microelectromechanical Systems · 2002 · 243 citations

Engineering, Mechanical Engineering, Silicon On Insulator +17

Roughness Induced Backscattering in Optical Silicon Waveguides

Francesco Morichetti, A. Canciamilla, C. Ferrari et al. · Physical Review Letters · 2010 · 164 citations

Photonics, Waveguides, Engineering +14

Anisotropic Reactive Ion Etching of Silicon Using  SF 6 /  O 2 /  CHF 3 Gas Mixtures

R. Legtenberg, Henri Jansen, M. de Boer et al. · Journal of The Electrochemical Society · 1995 · 159 citations

Low-crosstalk 2 × 2 thermo-optic switch with silicon wire waveguides

Yuya Shoji, Kenji Kintaka, Satoshi Suda et al. · Optics Express · 2010 · 127 citations · Full text

Photonics, Low-crosstalk 2, Optical Materials +13