IEEE Transactions on Device and Materials Reliability · 2020 · 15 citations · 18 references
Radiation HardeningEngineeringVlsi DesignIntegrated CircuitsCmos TechnologyNew Rtic DesignHigh ReliabilityDevice ModelingElectrical EngineeringHardware ReliabilityRadiation-hard DesignBias Temperature InstabilityComputer EngineeringSingle Event EffectsRadiation DamageDevice ReliabilityMicroelectronicsCmos IcCircuit ReliabilityBeyond Cmos
As the standard complementary metal-oxide-semiconductor (CMOS) integrated circuit (IC) generates a leakage current due to ionizing radiation reacting with silicon in a radiological environment, radiation hardening of CMOS devices is being actively investigated. If a radiation-tolerant IC (RTIC) is designed, it is very important to examine the design possibility of an application specific IC (ASIC) that uses a radiation-tolerant MOS field-effect transistor (MOSFET). This study developed a new RTIC design using an I-gate structure that is more effective in terms of time, cost, and reliability than the existing RTMOSFET. Because an RTIC with an I-gate structure can be fabricated via the usual full-custom IC design process, it can be produced after its reliability is ensured based on post-layout simulation results, which are obtained by layout parasitic extraction (LPE). To realize the possibility of such fabrication, radiation-tolerant digital and analog ICs were designed and fabricated in the standard 0.18-μm CMOS process, and an irradiation test was conducted up to a total dose of approximately 2 Mrad. Accordingly, the radiation damage in the standard IC and the radiation tolerance of the RTIC were identified. Consequently, we have proposed and verified an efficient radiation-tolerant ASIC design solution.
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Post-Irradiation Effects in Field-Oxide Isolation Structures
Timothy R. Oldham, Aivars J. Lelis, H. E. Boesch et al. · IEEE Transactions on Nuclear Science · 1987 · 101 citations · Full text