IEEE Transactions on Electron Devices · 2018 · 56 citations · 12 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsMicroelectronicsSemiconductor DevicesMemory DevicesMemristive MaterialsEnduranceMemory Cell DesignMemory Circuit DesignMemory MaterialsMemristive MemoryNonvolatile Memory MaterialsPhase-change MemoryThree-dimensional Memory
High endurance ovonic threshold switch (OTS, here, TeAsGeSiSe-based) is integrated with phase change memory (PCM, here, doped Ge2Sb2Te5) to form a 3-D stackable pillar-type device. With the help of an etch buffer layer and a damage-free pillar reactive-ion etching process, we successfully demonstrate one-selector (OTS)/one-resistor (PCM) (1S1R OTS-PCM) pillar device without OTS/PCM composition modification. High temperature 400 °C annealing tests show this 1S1R OTS-PCM pillar device is back end of line compatible. We report the fundamental behavior of the OTS and the operation scheme of the 1S1R OTS-PCM device. The new Vth read scheme is proposed and excellent electrical performance is demonstrated. It provides the fast turn ON/ OFF speed which enables 10-ns fast RESET speed. Program endurance greater than 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">9</sup> cycles is achieved, and read endurance is higher than 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">11</sup> cycles.
12
A stackable cross point Phase Change Memory
D. Kau, Stephen Tang, I. V. Karpov et al. · 2009 · 285 citations
Engineering, Computer Engineering, Electrical Engineering +13
PRAM cell technology and characterization in 20nm node size
Minjin Kang, Taegun Park, Yong-Jin Kwon et al. · 2011 · 95 citations