Three-dimensional Memory

Three-Dimensional Memory is a semiconductor memory architecture that extends data storage and access across vertically stacked layers of memory cells, enabling higher density and improved performance compared to planar designs by exploiting three-dimensional integration.

656

Publications

33.5K

Citations

3.6K

Authors

468

Institutions

Publications per year

2017–2026

248

Variants

3D Memory

Authors

3.6K

  1. YX
    Yuan Xie

    Pennsylvania State University, United States

    17 publications · 962 citations

    16

    h-index

  2. SY
    Shimeng Yu

    Georgia Institute of Technology, United States

    18 publications · 1.1K citations

    15

    h-index

  3. HP
    H.‐S. Philip Wong

    Stanford University, United States

    16 publications · 1.1K citations

    15

    h-index

  4. HL
    Hang-Ting Lue

    Macronix International (Taiwan), Taiwan

    19 publications · 563 citations

    14

    h-index

  5. ZH
    Zongliang Huo

    Institute of Microelectronics, China

    14 publications · 329 citations

    13

    h-index

1–5 of 3.6K

Venues

  1. IEEE Transactions on Electron Devices

    28 publications · 982 citations

    19

    h-index

  2. IEEE Electron Device Letters

    24 publications · 702 citations

    17

    h-index

  3. Applied Physics Letters

    14 publications · 824 citations

    13

    h-index

  4. IEEE Journal of Solid-State Circuits

    17 publications · 1.2K citations

    13

    h-index

  5. Optics Letters

    10 publications · 1.4K citations

    10

    h-index

1–5