IEEE Electron Device Letters · 2018 · 29 citations · 11 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsMicroelectronicsSemiconductor DevicesDevice ModelingHigh-frequency Semiconductor DevicesIii-v SemiconductorsWide Band Gap SemiconductorsWide-bandgap Semiconductor DevicesCurrent GainHigh-electron-mobility TransistorsMetal-oxide-semiconductor Field-effect Transistor ModelingMillimeter-wave Transistors
We present our latest results on L <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">g</sub> = 87 nm InAlAs/InGaAs high-electron-mobility transistors with an excellent combination of dc and high-frequency characteristics. We obtained a maximum transconductance of 3 S/mm at V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DS</sub> = 0.9 V, an ON-resistance of 273 Ω-μm, a current gain cutoff frequency of 559 GHz, and a maximum oscillation frequency of 671 GHz. According to small-signal modeling, these outstanding device metrics are a consequence of the indium-rich InGaAs channel with very high Hall mobility, compact device design with L <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">SD</sub> = 1 μm, and an optimized gate process that yields well-tempered behavior.
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Sub 50 nm InP HEMT Device with Fmax Greater than 1 THz