Comparison of HF and HCl cross-contamination between different ENTEGRIS FOUP platforms and Cu-coated wafers

Identification and quantification of FOUP molecular contaminants inducing defects in integrated circuits manufacturing

Thi Quynh Nguyen, Hervé Fontaine, Yannick Borde et al. · Microelectronic Engineering · 2012 · 28 citations

Engineering, Manufacturing Engineering, Impurity Profiling +12

Controlling Ambient Gas in Slot-to-Slot Space Inside FOUP to Suppress Cu-Loss After Dual Damascene Patterning

Takao Kamoshima, Yasuhisa Fujii, Toshimitsu Noguchi et al. · IEEE Transactions on Semiconductor Manufacturing · 2008 · 23 citations

Engineering, Materials Engineering, Materials Science +13

Case Study of Micro-Contamination Control

Shou-Nan Li, Hui-Ya Shih, Shaw-Yi Yen et al. · Aerosol and Air Quality Research · 2007 · 23 citations · Full text

Engineering, Chemical Engineering, Air Quality Management +16

Unintentional Doping of Wafers Due to Organophosphates in the Clean Room Ambient

John A. Lebens, W. C. McColgin, J. B. Russell et al. · Journal of The Electrochemical Society · 1996 · 20 citations

Engineering, Materials Engineering, Materials Science +16

A comparative study of the HF sorption and outgassing ability of different Entegris FOUP platforms and materials

Paola González‐Aguirre, Hervé Fontaine, C. Beitia et al. · Microelectronic Engineering · 2012 · 17 citations

Natural Sciences, Chemical Engineering, Materials Science +8