Paola González‐Aguirre

Deposition of hydrogen chloride gas on copper wafer depending on humidity and HCl concentration

Minh‐Phuong Tran, Paola González‐Aguirre, C. Beitia et al. · Microelectronic Engineering · 2019 · 18 citations · Full text

Natural Sciences, Chemical Engineering, Chemistry +15

A comparative study of the HF sorption and outgassing ability of different Entegris FOUP platforms and materials

Paola González‐Aguirre, Hervé Fontaine, C. Beitia et al. · Microelectronic Engineering · 2012 · 17 citations

Natural Sciences, Chemical Engineering, Materials Science +8

Morphology and rheological behavior of maltene–polymer blends. I. Effect of partial hydrogenation of poly(styrene‐<i>block</i>‐butadiene‐<i>block</i>‐styrene‐<i>block</i>)‐type copolymers

Paola González‐Aguirre, Luís Medina‐Torres, Cornélius Schrauwen et al. · Journal of Applied Polymer Science · 2009 · 15 citations

Natural Sciences, Materials Engineering, Materials Science +17

Comparison of HF and HCl cross-contamination between different ENTEGRIS FOUP platforms and Cu-coated wafers

Fernando Herrán, Paola González‐Aguirre, C. Beitia et al. · Microelectronic Engineering · 2016 · 15 citations

Engineering, Chemical Engineering, Materials Engineering +9

FOUP decontamination solutions to control AMCs in semiconductor fabs: Gas purge or wet cleaning?

Paola González‐Aguirre, Hervé Fontaine, Seung Il Moon et al. · Microelectronic Engineering · 2018 · 15 citations

Engineering, Chemical Engineering, Process Safety +15