C. Beitia

Metrology for the next generation of semiconductor devices

Ndubuisi G. Orji, Mustafa Badaroglu, Brian M. Barnes et al. · Nature Electronics · 2018 · 451 citations · Full text

Semiconductor Technology, Electrical Engineering, Next Generation +9

1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy

A. Jouve, V. Balan, N. Bresson et al. · 2017 · 35 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Adsorption kinetics of H on Si(111)7×7 by means of surface differential reflectivity

C. Beitia, R. Del Sole, Y. Borensztein · Physical review. B, Condensed matter · 1997 · 31 citations

Engineering, Chemistry, Chemical Engineering +19

Substrate-induced multipolar resonances in supported free-electron metal spheres

C. Beitia, Y. Borensztein, Rémi Lazzari et al. · Physical review. B, Condensed matter · 1999 · 30 citations

Multipolar Coupling, Engineering, Physics +14

Spectroscopic Investigations of Borosilicate Glass and Its Application as a Dopant Source for Shallow Junctions

M Nolan, T. S. Perova, Robert A. Moore et al. · Journal of The Electrochemical Society · 2000 · 17 citations

Materials Science, Materials Engineering, Dopant Source +14