Concepedia
Journal of Materials Science Materials in Electronics · 2016 · 14 citations · 22 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsMetallic MaterialsDevice ReliabilitySemiconductor ReliabilityElectromigrationElectromigration AnalysisElectromigration ReliabilitySolder Joint StrengthSolderabilitySoldered JointsSoldering Joints
22
Recent advances on electromigration in very-large-scale-integration of interconnects
K. N. Tu · Journal of Applied Physics · 2003 · 1.1K citations
Engineering, Electrical Engineering, Materials Science +17
Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth
Yi-Wun Wang, Chia-Wei Chang, C. R. Kao · Journal of Alloys and Compounds · 2008 · 91 citations
Natural Sciences, Materials Engineering, Materials Science +5
Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect
Liuhan Chen, Mingliang Huang, Shaoming Zhou · Journal of Alloys and Compounds · 2010 · 86 citations
Engineering, Electrical Engineering, Materials Engineering +13
Effect of graphene doping on microstructural and mechanical properties of Sn–8Zn–3Bi solder joints together with electromigration analysis
Xiao Hu, Y.C. Chan, Kaili Zhang et al. · Journal of Alloys and Compounds · 2013 · 81 citations
Engineering, Materials Engineering, Materials Science +17
Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn–58Bi solder joints
Tianwei Hu, Yi Li, Yan‐Cheong Chan et al. · Microelectronics Reliability · 2015 · 62 citations
Natural Sciences, Materials Engineering, Materials Science +13