Xiao Hu

Effect of graphene doping on microstructural and mechanical properties of Sn–8Zn–3Bi solder joints together with electromigration analysis

Xiao Hu, Y.C. Chan, Kaili Zhang et al. · Journal of Alloys and Compounds · 2013 · 81 citations

Engineering, Materials Engineering, Materials Science +17

Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection

Xiao Hu, Sha Xu, Ying Yang et al. · Materials Science and Engineering A · 2014 · 31 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15

A highly sensitive and precise temperature sensor based on optoelectronic oscillator

Luoqiu Xu, Xiao Hu, Yuguang Zhang et al. · Optics Communications · 2020 · 22 citations

Engineering, Electrical Engineering, Optoelectronics +13

Effect of carbon nanotubes and their dispersion on electroless Ni–P under bump metallization for lead-free solder interconnection

Sha Xu, Xiao Hu, Ying Yang et al. · Journal of Materials Science Materials in Electronics · 2014 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +17

Reinforced solder joint performance by incorporation of ZrO₂ nanoparticles in electroless Ni–P composite layer

Xiao Hu, Y.C. Chan · Journal of materials research/Pratt's guide to venture capital sources · 2014 · 11 citations

Natural Sciences, Materials Engineering, Materials Science +12