Concepedia

Publication | Closed Access

Surface effect induced Cu-Cu bonding by Cu nanosolder paste

DOI

47

Citations

7

References

2016

Year

J.J. Li, Chaoliang Cheng, T.L. Shi, Jiahui Fan, Xing Yu, Siyi Cheng, Guanglan Liao, Zirong Tang
Materials Letters

References

YearCitations

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