Statistics
Publications
1
Citations
47
H-Index
1
Active since
2016
Affiliations
T.L. Shi is an author at Huazhong University of Science and Technology specializing in copper nanocoatings, surface science, and copper alloys.
Publications per year
2016–2016
1
1
Surface effect induced Cu-Cu bonding by Cu nanosolder paste
J.J. Li, Chaoliang Cheng, T.L. Shi et al. · Materials Letters · 2016 · 47 citations
Natural Sciences, Materials Engineering, Materials Science +13
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