Xing Yu

A green approach of synthesizing of Cu-Ag core-shell nanoparticles and their sintering behavior for printed electronics

Xing Yu, Junjie Li, Tielin Shi et al. · Journal of Alloys and Compounds · 2017 · 105 citations

Materials Engineering, Materials Science, Chemical Engineering +11

Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste

Junjie Li, Xing Yu, Tielin Shi et al. · Nanoscale Research Letters · 2017 · 77 citations · Full text

Double-shelled hollow hetero-MnCo2S4/CoS1.097 spheres with carbon coating for advanced supercapacitors

Xing Yu, Jiali Yu, Long Hou et al. · Journal of Power Sources · 2018 · 66 citations

Materials Science, Supercapacitors, Engineering +8

Depressing of Cu Cu bonding temperature by composting Cu nanoparticle paste with Ag nanoparticles

Junjie Li, Xing Yu, Tielin Shi et al. · Journal of Alloys and Compounds · 2017 · 54 citations

Materials Science, Materials Engineering, Chemical Engineering +8

Surface effect induced Cu-Cu bonding by Cu nanosolder paste

J.J. Li, Chaoliang Cheng, T.L. Shi et al. · Materials Letters · 2016 · 47 citations

Materials Science, Engineering, Surface Effect +3