Depressing of Cu Cu bonding temperature by composting Cu nanoparticle paste with Ag nanoparticles

Junjie Li, Xing Yu, Tielin Shi, Chaoliang Cheng, Jinhu Fan, Siyi Cheng, Tianxiang Li, Guanglan Liao, Zirong Tang

Journal of Alloys and Compounds · 2017 · 54 citations · 31 references

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