Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging

Jianfeng Yan, Jianfeng Yan, Guisheng Zou, Aiping Wu, Ren Jialie, Jiuchun Yan, Jiuchun Yan, Anming Hu, Y. Zhou

Scripta Materialia · 2012 · 209 citations · 18 references

Concepts

References

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