Concepedia

Effectiveness and Reliability of Metal Diffusion Barriers for Copper Interconnects

Gang Bai, S. Wittenbrock, V. Ochoa, R. Villasol, Chien Chiang, T. Marieb, Donald S. Gardner, Chun Mu, David B. Fraser, M. Bohr

MRS Proceedings · 1995 · 12 citations · 1 references

DOI

Concepts

References

1

Diffusion of copper through dielectric films under bias temperature stress

G. Raghavan, Chien Chiang, Paul B. Anders et al. · Thin Solid Films · 1995 · 154 citations

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