T. Marieb

A 65nm logic technology featuring 35nm gate lengths, enhanced channel strain, 8 Cu interconnect layers, low-k ILD and 0.57 μm/sub 2/ SRAM cell

Peng Bai, C. Auth, S. Balakrishnan et al. · 2005 · 230 citations

Electrical Engineering, Physical Design (Electronics), Engineering +15

High spatial resolution grain orientation and strain mapping in thin films using polychromatic submicron x-ray diffraction

Nobumichi Tamura, Alastair A. MacDowell, Richard Celestre et al. · Applied Physics Letters · 2002 · 87 citations · Full text

X-ray Spectroscopy, Engineering, Severe Plastic Deformation +20

Observations of electromigration induced void nucleation and growth in polycrystalline and near-bamboo passivated Al lines

T. Marieb, P. A. Flinn, J. C. Bravman et al. · Journal of Applied Physics · 1995 · 64 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Local Plasticity of Al Thin Films as Revealed by X-Ray Microdiffraction

Ralph Spolenak, W. L. Brown, Nobumichi Tamura et al. · Physical Review Letters · 2003 · 60 citations

Aluminium Nitride, Engineering, Severe Plastic Deformation +19

Stress-Induced Void Formation in Metal Lines

Paul A. Flinn, Anne Sauter Mack, Paul R. Besser et al. · MRS Bulletin · 1993 · 39 citations

Materials Science, Engineering, Surface Science +7