A 65nm logic technology featuring 35nm gate lengths, enhanced channel strain, 8 Cu interconnect layers, low-k ILD and 0.57 μm/sub 2/ SRAM cell

Peng Bai, C. Auth, S. Balakrishnan, +32

Electrical EngineeringPhysical Design (Electronics)EngineeringVlsi DesignChannel Strain +13

High spatial resolution grain orientation and strain mapping in thin films using polychromatic submicron x-ray diffraction

Nobumichi Tamura, Alastair A. MacDowell, Richard Celestre, +9

Applied Physics Letters

X-ray SpectroscopyEngineeringSevere Plastic DeformationMicroscopyX-ray Synchrotron Technique +18

Observations of electromigration induced void nucleation and growth in polycrystalline and near-bamboo passivated Al lines

T. Marieb, P. A. Flinn, J. C. Bravman, +2

Journal of Applied Physics

Materials ScienceMaterials EngineeringElectrical EngineeringAluminium NitrideEngineering +13

Local Plasticity of Al Thin Films as Revealed by X-Ray Microdiffraction

Ralph Spolenak, W. L. Brown, Nobumichi Tamura, +9

Physical Review Letters

Aluminium NitrideEngineeringSevere Plastic DeformationGrain SizeAl Thin Films +17

Stress-Induced Void Formation in Metal Lines

Paul A. Flinn, Anne Sauter Mack, Paul R. Besser, +1

MRS Bulletin

Materials ScienceEngineeringSurface ScienceApplied PhysicsMetallurgical Interaction +5

Electromigration lifetime and critical void volume

Jun He, Zhigang Suo, T. Marieb, +1

Applied Physics Letters

EngineeringTransport PhenomenaStatistical DistributionElectronic PackagingElectrochemical Interface +14

High Resolution Observation of Void Motion in Passivated Metal Lines Under Electromigration Stress

Michael C. Madden, Edward V. Abratowski, T. Marieb, +1

MRS Proceedings

Electrical EngineeringElectromigration TechniqueEngineeringSurface ScienceMechanical Engineering +10

Measurement and interpretation of strain relaxation in passivated Al–0.5% Cu lines

Paul R. Besser, T. Marieb, Jin Lee, +2

Journal of materials research/Pratt's guide to venture capital sources

Materials EngineeringMaterials ScienceElectromigration TechniqueEngineeringStrain Relaxation +4

Mechanical behaviour of submicron multilayers submitted to microtensile experiments

Maria Ignat, T. Marieb, H. Fujimoto, +1

Thin Solid Films

EngineeringMicromechanicsMechanical PropertiesMicrofabricationMechanical Engineering +6

The evolution of the resistance of aluminum interconnects during electromigration

Jonathan C. Doan, J. C. Bravman, Paul A. Flinn, +1

Microelectronics Reliability

Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringSpecific Resistance +10