Concepedia

Publication | Closed Access

Diffusion of copper through dielectric films under bias temperature stress

DOI

153

Citations

6

References

1995

Year

G. Raghavan, Chien Chiang, Paul B. Anders, Sing-Mo Tzeng, R. Villasol, Gang Bai, M. Bohr, David B. Fraser
Thin Solid Films

References

YearCitations

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