Electromigration Behavior in Layered Ti/AlCu/Ti Films and its Dependence on Intermetallic Structure

Diffusion in the titanium-aluminium system—I. Interdiffusion between solid Al and Ti or Ti-Al alloys

F.J.J. van Loo, G. D. Rieck · Acta Metallurgica · 1973 · 406 citations

Natural Sciences, Materials Engineering, Materials Science +14

Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films

Shefali Vaidya, A. K. Sinha · Thin Solid Films · 1981 · 354 citations

Natural Sciences, Materials Engineering, Materials Science +12

Reduction of Electromigration in Aluminum Films by Copper Doping

I. Ames, F. M. d’Heurle, R. E. Horstmann · IBM Journal of Research and Development · 1970 · 301 citations

Natural Sciences, Materials Engineering, Materials Science +17

SLT Device Metallurgy and its Monolithic Extension

P. A. Totta, R.P. Sopher · IBM Journal of Research and Development · 1969 · 241 citations

Engineering, Materials Engineering, Materials Science +15

Diffusion phenomena in thin films and microelectronic materials

H.K.H. · Materials Research Bulletin · 1989 · 218 citations

Natural Sciences, Materials Engineering, Materials Science +16