Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films

Electromigration Damage in Aluminum Film Conductors

M. J. Attardo, R. Rosenberg · Journal of Applied Physics · 1970 · 264 citations

Natural Sciences, Materials Engineering, Materials Science +16

Linewidth dependence of electromigration in evaporated Al-0.5%Cu

Shefali Vaidya, T. T. Sheng, A. K. Sinha · Applied Physics Letters · 1980 · 176 citations

Natural Sciences, Materials Engineering, Materials Science +9

Electromigration and failure in electronics: An introduction

F. M. d’Heurle · Proceedings of the IEEE · 1971 · 166 citations

Natural Sciences, Electrical Engineering, Materials Science +17

Dependence of Electromigration-Induced Failure Time on Length and Width of Aluminum Thin-Film Conductors

B. Agarwala, M. J. Attardo, A. P. Ingraham · Journal of Applied Physics · 1970 · 119 citations

Natural Sciences, Electrical Engineering, Materials Science +17

Influence of Deposition Parameters on the Coalescence Stage of Growth of Metal Films

Kasturi Lal Chopra, M. R. Randlett · Journal of Applied Physics · 1968 · 71 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17