2015 · 17 citations · 2 references
EngineeringComputer EngineeringElectrical EngineeringPhotonicsSemiconductor DevicesSensorsChip PackagingIntegrated Circuit DesignIntegrated Circuit DevicesIntegrated PhotonicsInterconnect TechnologySensor Integration3D Integrated CircuitsSiliconThree-dimensional Integrated Circuit InterconnectsThree-dimensional Integrated Circuit LayoutThree-dimensional IntegrationThree-dimensional MemoryThrough-silicon Via PackagingThrough-silicon Vias
From low density 3D integrations embedding Via Last Through Silicon Vias (TSV) to high densities hybrid bonding or 3D VSLI CoolCubeTM solutions, a multitude of new product opportunities is now envisioned. An overview of existing emerging 3D integrations is provided covering Image sensors, Photonics, MEMS, Wide I/O memories and Silicon Interposers for advanced logics. Associated key challenges and developments are highlighted focusing on 3D platform performance assessment.
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Metal Powder Report · 1994 · 2K citations