J. Michailos - Concepedia

Author

J. Michailos

Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Also Known As

J Michailos, J. Michailos, Jean Michailos

Publications

529

Citations

H-Index

Concepts

All Affiliations

Commissariat à l'Énergie Atomique et aux Énergies Alternatives Institut polytechnique de Grenoble Laboratoire d'Électronique des Technologies de l'Information Université Grenoble Alpes STMicroelectronics (France)

About

J. Michailos is an author at Commissariat à l'Énergie Atomique et aux Énergies Alternatives specializing in engineering, microelectronics, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	11	469
2	Applied Physics	4	4	145
3	Health Sciences	1	1	56
4	Natural Sciences	1	1	16
5	Chemical Engineering	1	1	48

J. Michailos

Publications

480

Citations

H-Index

Page 1

	Year	Citations
Color filters including infrared cut-off integrated on CMOS image sensor Laurent Frey, Pascale Parrein, Jacques Raby, Optics Express PhotonicsColor ImageOptical MaterialsEngineeringInfrared Filter	2011	80
Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures P. Coudrain, P. Chausse, L. Arnaud, EngineeringSuccessful Structural TestComputer ArchitectureAdvanced Packaging (Semiconductors)Active Interposer Technology	2019	63
<title>Amorphous silicon x-ray image sensor</title> J. Chabbal, C. Chaussat, Thierry Ducourant, Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE EngineeringIntegrated CircuitsImage SensorX-ray FluorescenceX-ray Imaging	1996	56
Low-Temperature Low-Resistivity PEALD TiN Using TDMAT under Hydrogen Reducing Ambient P. Caubet, Tom Blomberg, R. Benaboud, Journal of The Electrochemical Society Hydrogen Energy TechnologyEngineeringChemistryChemical DepositionChemical Engineering	2008	48
Fully Optimized Cu based process with dedicated cavity etch for 1.75&amp;#x003BC;m and 1.45&amp;#x003BC;m pixel pitch CMOS Image Sensors Muriel Cohen, F. Roy, Didier Hérault, Electrical EngineeringWafer Scale ProcessingEngineeringMicrofabricationMixed-signal Integrated Circuit	2006	45
A 0.9 pJ/bit, 12.8 GByte/s WideIO memory interface in a 3D-IC NoC-based MPSoC Denis Dutoit, Christian Bernard, S. Chéramy, Non-volatile MemoryElectrical Engineering3D-ic Noc-based MpsocEngineeringVlsi Design	2013	44
Through Silicon Vias Technology for CMOS Image Sensors Packaging: Presentation of Technology and Electrical Results David Henry, Jean Charbonnier, P. Chausse, Electrical ResistanceElectrical ResultsEngineeringDevice IntegrationLow Temperature 'Via-last	2008	33
A $4 \times 4 \times 2$ Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links Pascal Vivet, Yvain Thonnart, R. Lemaire, IEEE Journal of Solid-State Circuits Network-on-chip CircuitEngineeringVlsi DesignComputer ArchitectureInterconnection Network Architecture	2016	32
Integration of fluorine-doped silicon oxide in copper pilot line for 0.12-μm technology J.-P. Reynard, C. Vérove, E. Sabouret, Microelectronic Engineering Materials Engineering0.12-μM TechnologyElectrical EngineeringEngineeringOxide Electronics	2002	28
8.1 a 4x4x2 homogeneous scalable 3d network-on-chip circuit with 326mflit/s 0.66pj/b robust and fault-tolerant asynchronous 3d links Pascal Vivet, Yvain Thonnart, R. Lemaire, Network-on-chip CircuitEngineeringVlsi DesignComputer ArchitectureInterconnection Network Architecture	2016	24

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