Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2010 · 16 citations · 4 references
EngineeringMaterials EngineeringMaterials ScienceMicroelectromechanical SystemsMicrofabricationSemiconductor DevicesAdhesive BondingChip PackagingFabrication MaterialsIntegrated Circuit FabricationVery-large-scale Integration LayoutWafer Bonding3D Integrated CircuitsAdhesivesSiliconSilicon WafersThree-dimensional IntegrationThrough-silicon ViasWafer Bonding MaterialsWafer-to-wafer Bonding
This paper will examine the combined use of both permanent and temporary high-temperature polyimide adhesives used to avoid thin wafer handling. While 3D-TSV technology can improve functionality and performance, adoption of this technology has been delayed by cracking as well as unwanted wafer bowing. This presentation shows means by which a photo-lithographic polyimide adhesive is used in a temporary bonding scheme to eliminate intermediate-stage thinned wafer handling.
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Bonding of silicon wafers for silicon-on-insulator
W. Maszara, Georges Goetz, A.L. Caviglia et al. · Journal of Applied Physics · 1988 · 861 citations