Chris Milasincic

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Active since

2010

Affiliations

Chris Milasincic is an author at DuPont (United States) specializing in very-large-scale integration layout, wafer-to-wafer bonding, and 3d integrated circuits.

Publications per year

2010–2010

Publications

Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing to Avoid Thin Wafer Handling

Melvin P. Zussman, Chris Milasincic, A. Rardin et al. · Journal of Microelectronics and Electronic Packaging · 2010 · 25 citations

Engineering, Materials Engineering, Materials Science +17

Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing To Avoid Thin Wafer Handling

Mel Zussman, Chris Milasincic, Anthony Rardin et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2010 · 16 citations · Full text

Engineering, Materials Engineering, Materials Science +17

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