Concepedia
Statistics
Publications
9
Citations
300
H-Index
Active since
1981
Affiliations
Wilmington University(Current)
Carnegie Mellon University
Experimental Station
Dow Chemical (United States)
Stanford University
Melvin P. Zussman is an author at Wilmington University specializing in natural sciences, materials science, and semiconductor devices.
Publications per year
1981–2012
Kinetics of copper drift in low-κ polymer interlevel dielectrics
Alvin L. S. Loke, J. T. Wetzel, P. H. Townsend et al. · IEEE Transactions on Electron Devices · 1999 · 135 citations
Natural Sciences, Electrical Engineering, Materials Engineering +17
Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling
Kai Zoschke, Thorsten Fischer, Michael J. Topper et al. · 2012 · 34 citations
Engineering, Materials Engineering, Materials Science +15
High temperature resistant bonding solutions enabling thin wafer processing (Characterization of polyimide base temporary bonding adhesive for thinned wafer handling)
Toshiaki Itabashi, Melvin P. Zussman · 2010 · 31 citations
Engineering, Materials Engineering, Materials Science +17
Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing to Avoid Thin Wafer Handling
Melvin P. Zussman, Chris Milasincic, A. Rardin et al. · Journal of Microelectronics and Electronic Packaging · 2010 · 25 citations
Backbone-assisted reactions of polymers. . Poly[(chloromethyl)thiirane]
Melvin P. Zussman, David A. Tirrell · Macromolecules · 1981 · 24 citations
Natural Sciences, Chemistry, Organic Chemistry +10
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