Concepedia
Statistics
Publications
4
Citations
114
H-Index
Active since
2010
Affiliations
Wilmington University(Current)
Experimental Station
Hitachi (Japan)
Toshiaki Itabashi is an author at Wilmington University specializing in materials science, engineering, and wafer bonding.
Publications per year
2010–2021
Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling
Kai Zoschke, Thorsten Fischer, Michael J. Topper et al. · 2012 · 34 citations
Engineering, Materials Engineering, Materials Science +15
High temperature resistant bonding solutions enabling thin wafer processing (Characterization of polyimide base temporary bonding adhesive for thinned wafer handling)
Toshiaki Itabashi, Melvin P. Zussman · 2010 · 31 citations
Engineering, Materials Engineering, Materials Science +17
Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing to Avoid Thin Wafer Handling
Melvin P. Zussman, Chris Milasincic, A. Rardin et al. · Journal of Microelectronics and Electronic Packaging · 2010 · 25 citations
A Novel Photosensitive Polyimide Adhesive Material for Hybrid Bonding Processing
Satoshi Yoneda, Kenya Adachi, Kaori Kobayashi et al. · 2021 · 24 citations
Engineering, Materials Engineering, Materials Science +12
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