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Publications
1
Citations
25
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Active since
2010
A. Rardin is an author specializing in chip packaging, microelectromechanical systems, and wafer bonding materials.
Publications per year
2010–2010
Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing to Avoid Thin Wafer Handling
Melvin P. Zussman, Chris Milasincic, A. Rardin et al. · Journal of Microelectronics and Electronic Packaging · 2010 · 25 citations
Engineering, Materials Engineering, Materials Science +17
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