J. T. Wetzel

Kinetics of copper drift in low-κ polymer interlevel dielectrics

Alvin L. S. Loke, J. T. Wetzel, P. H. Townsend et al. · IEEE Transactions on Electron Devices · 1999 · 135 citations

Materials Science, Materials Engineering, Electrical Engineering +13

Implementation of an imprint damascene process for interconnect fabrication

Gerard M. Schmid, M. D. Stewart, J. T. Wetzel et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2006 · 82 citations

Dual Damascene Approach, Engineering, Electron-beam Lithography +18

Observation and interpretation of the atomic structure of a [Sgrave] = 19/[110] (3<ovl>3</ovl>1) tilt boundary in Au thin films

William Krakow, J. T. Wetzel, D. A. Smith · Philosophical magazine. A/Philosophical magazine. A. Physics of condensed matter. Structure, defects and mechanical properties · 1986 · 77 citations

Evaluation of ultra-low-k dielectric materials for advanced interconnects

C. Jin, Su-Jien Lin, J. T. Wetzel · Journal of Electronic Materials · 2001 · 54 citations

Materials Science, Electrical Engineering, Ultra-low-k Dielectric Materials +7

Low-k dielectrics characterization for damascene integration

S.-W. Lin, C. Jin, L. M. Lui et al. · 2001 · 25 citations

Engineering, Material Innovation, Chemistry +19