Concepedia

Evaluation of ultra-low-k dielectric materials for advanced interconnects

C. Jin, Su-Jien Lin, J. T. Wetzel

Journal of Electronic Materials · 2001 · 54 citations · 10 references

DOI

Concepts

References

10

An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments

W. C. Oliver, George M. Pharr · Journal of materials research/Pratt's guide to venture capital sources · 1992 · 26.6K citations

, , +16

Continuous formation of supported cubic and hexagonal mesoporous films by sol–gel dip-coating

Yunfeng Lu, Rahul Ganguli, Celeste A. Drewien et al. · Nature · 1997 · 1.5K citations

, , +16

Thermal conductivity of<i>a</i>-Si:H thin films

David G. Cahill, Monica Katiyar, John R. Abelson · Physical review. B, Condensed matter · 1994 · 516 citations

, , +17

Progress in Electroluminescent Devices Using Molecular Thin Films

Tetsuo Tsutsui · MRS Bulletin · 1997 · 280 citations

, , +10

Particle-Packing Phenomena and Their Application in Materials Processing

Dennis R. Dinger, James E. Funk · MRS Bulletin · 1997 · 249 citations

, , +16