James Hermanowski is an author at SUSS MicroTec (Germany) specializing in applied physics, 3d printing, and electronic packaging.
Top concepts
3D PrintingEngineeringApplied PhysicsMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingMechanical EngineeringHeat TransferThermal Engineering
Publications per year
2009–2010
2
2
Thin Wafer Handling Challenges and Emerging Solutions
Shari Farrens, Peter Bisson, Sumant Sood et al. · ECS Transactions · 2010 · 10 citations
Engineering, Mechanical Engineering, Wafer Scale Processing +16
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1–2 of 2