Shari Farrens

Chemical Free Room Temperature Wafer To Wafer Direct Bonding

Shari Farrens, James Dekker, Jason Kenneth Smith et al. · Journal of The Electrochemical Society · 1995 · 146 citations

Engineering, Integrated Circuits, Vacuum Device +16

Cyclo-Olefin polymer direct bonding using low temperature plasma activation bonding

J. Mizuno, Hiroyasu Ishida, Shari Farrens et al. · 2005 · 29 citations

Engineering, Analytical Microsystems, Chemistry +20

Aligned wafer bonding: A key to three dimensional microstructures

R.W. Bower, M.S. Ismail, Shari Farrens · Journal of Electronic Materials · 1991 · 28 citations

Materials Science, 3D Ic Architecture, Wafer Scale Processing +7

New Results on Plasma Activated Bonding of Imprinted Polymer Features for Bio MEMS Applications

Paul Kettner, R. Pelzer, T. Glinsner et al. · Journal of Physics Conference Series · 2006 · 24 citations · Full text

High Resolution, Engineering, Plasma Activated Bonding +21

Cu to Cu interconnect using 3D-TSV and wafer to wafer thermocompression bonding

Cedric Huyghebaert, J. Van Olmen, Yann Civale et al. · 2010 · 20 citations

Engineering, Interconnect (Integrated Circuits), Wafer Scale Processing +16