Peter Bisson

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding

Alain Phommahaxay, Anne Jourdain, Greet Verbinnen et al. · 2012 · 34 citations

Engineering, Manufacturing Engineering, Materials Science +15

Compact design of a low temperature XY stage scanning tunneling microscope

C. Dubois, Peter Bisson, A. A. Manuel et al. · Review of Scientific Instruments · 2006 · 20 citations

Natural Sciences, Materials Science, Physics +14

300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications

Anne Jourdain, Thibault Buisson, Alain Phommahaxay et al. · 2010 · 18 citations

Engineering, Materials Engineering, Materials Science +15

Thin Wafer Handling Challenges and Emerging Solutions

Shari Farrens, Peter Bisson, Sumant Sood et al. · ECS Transactions · 2010 · 10 citations

Engineering, Materials Engineering, Materials Science +17