Sumant Sood

Cu to Cu interconnect using 3D-TSV and wafer to wafer thermocompression bonding

Cedric Huyghebaert, J. Van Olmen, Yann Civale et al. · 2010 · 20 citations

Engineering, Interconnect (Integrated Circuits), Wafer Scale Processing +16

300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications

Anne Jourdain, Thibault Buisson, Alain Phommahaxay et al. · 2010 · 18 citations

Engineering, Mechanical Engineering, Wafer Scale Processing +16

Al-Ge Eutectic Wafer Bonding and Bond Characterization for CMOS Compatible Wafer Packaging

Sumant Sood, Shari Farrens, Ron Pinker et al. · ECS Transactions · 2010 · 18 citations

Materials Engineering, Materials Science, Electrical Engineering +15

Thin Wafer Handling Challenges and Emerging Solutions

Shari Farrens, Peter Bisson, Sumant Sood et al. · ECS Transactions · 2010 · 10 citations

Engineering, Mechanical Engineering, Wafer Scale Processing +16