Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages

Electrically conductive adhesives for surface mount solder replacement

Mark Zwoliński, James J. Hickman, Holly-Dee Rubin et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part C · 1996 · 143 citations

Natural Sciences, Materials Engineering, Materials Science +15

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature

Y.C. Chan, D.Y Luk · Microelectronics Reliability · 2002 · 117 citations

Engineering, Materials Engineering, Materials Science +17

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure

Y.C. Chan, D.Y Luk · Microelectronics Reliability · 2002 · 113 citations

Engineering, Materials Engineering, Materials Science +13

Acid-base properties of glass surfaces

Frederick M. Fowkes, David W. Dwight, David A. Cole et al. · Journal of Non-Crystalline Solids · 1990 · 98 citations

Natural Sciences, Materials Engineering, Materials Science +12

Overview of conductive adhesive joining technology in electronics packaging applications

J. Liu, Z. Lai, Helge Kristiansen et al. · 2002 · 68 citations

Engineering, Electrical Engineering, Materials Engineering +13