IEEE Transactions on Components and Packaging Technologies · 2001 · 20 citations · 11 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsMetallic MaterialsMetallurgyDevice ReliabilityElectronic Material CharacterizationInterconnect TechnologyMetalsSemiconductor ReliabilitySocket DesignElastomer PerformanceElectrical Interconnect ReliabilityElectromigration ReliabilityElectronic Component MaintenanceFailure ModesInterconnect CharacterizationInterconnect ReliabilityReliability Assessment
The use of very high I/O count electronic components, driven by higher performance and functionality requirements, has significantly impacted surface mount assembly yields. Metal particle-in-elastomer sockets were introduced to provide a solderless interconnection alternative with high I/O capability; easy assembly, rework, and maintenance; and the ability to upgrade components in the field. However as a new technology, elastomer sockets need to be assessed in terms of their reliability. A successful reliability assessment must be based on an understanding of the functional, performance, and life requirements; the environmental and operational life-cycle conditions; materials and design properties; and potential failure modes and mechanisms. This paper presents recent studies by the CALCE Electronic Products and Systems Center in characterizing the materials and design properties of a commercially available (Thomas and Betts) metal particle-in-elastomer interconnection system. These studies revealed the potential failure modes and mechanisms of this elastomer socket, and can be used to select suitable application parameters when using this socket. The results may also serve as a reference for technology insertion and evaluation of other elastomer interconnection systems.
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C. Pierre, R. Deltour, J. A. A. J. Perenboom et al. · Physical review. B, Condensed matter · 1990 · 31 citations
Natural Sciences, Materials Engineering, Materials Science +17