Through-silicon via stress characteristics and reliability impact on 3D integrated circuits

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3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration

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Engineering, Electrical Engineering, Materials Science +17

Three-dimensional silicon integration

John Knickerbocker, Paul Andry, B. Dang et al. · IBM Journal of Research and Development · 2008 · 493 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17