Study of the Drain Leakage Current in Bottom-Gated Nanocrystalline Silicon Thin-Film Transistors by Conduction and Low-Frequency Noise Measurements

Argyrios T. Hatzopoulos, N. Arpatzanis, D.H. Tassis, C.A. Dimitriadis, Maher Oudwan, Franois Templier, George Kamarinos

IEEE Transactions on Electron Devices · 2007 · 17 citations · 22 references

Concepts

Abstract

The drain leakage current in n-channel bottom-gated nanocrystalline silicon (nc-Si) thin-film transistors is investigated systematically by conduction and low-frequency noise measurements. The presented results indicate that the leakage current, controlled by the reverse biased drain junction, is due to Poole-Frenkel emission at low electric fields and band-to-band tunneling at large electric fields. The leakage current is correlated with single-energy traps and deep grain boundary trap levels with a uniform energy distribution in the band gap of the nc-Si. Analysis of the leakage current noise spectra indicates that the grain boundary trap density of 8.5 times 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">12</sup> cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-2</sup> in the upper part of the nc-Si film is reduced to 2.1 times 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">12</sup> cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-2</sup> in the lower part of the film, which is attributed to a contamination of the nc-Si bulk by oxygen

References

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