IEEE Transactions on Industrial Electronics · 2010 · 104 citations · 13 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsDevice CharacterizationDevice ReliabilitySemiconductor Device MaterialsSemiconductor ReliabilityWide Band Gap SemiconductorsWide-bandgap Semiconductor DevicesEnduranceFabricationGold ElectrodesMetallizationRadiation HardnessSilicon CarbideThermal CyclingThermal Cycling Testing
This paper reports on the fabrication technology and packaging strategy for 300-V 5-A silicon carbide Schottky diodes with a wide temperature operation range capability (between -170 °C and 300 °C). These diodes have been designed for harsh environment space applications such as inner Solar System exploration probes. Different endurance tests have been performed to evaluate the diode behavior when working at a high temperature and under severe thermal cycling conditions (ranged from -170 °C to 270 °C). The radiation hardness capability has been also tested. It has been found that the hermeticity of the package in a neutral atmosphere is a key aspect to avoid an electrical parameter drift. Moreover, the use of gold metallization and gold wire bonds on the anode allows reducing the diode surface and bonding degradation when compared to Al-containing technology. On the back-side cathode contact, the Ti/Ni/Au metallization and AuGe combination have shown a very good behavior. As a result, the manufactured diodes demonstrated high stability for a continuous operation at 285 °C.
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Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules
L. Coppola, D. Huff, F. Wang et al. · 2007 · 136 citations
Reliability of SiC MOS devices
Ranbir Singh, Allen R. Hefner · Solid-State Electronics · 2004 · 113 citations