D. Huff

Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules

L. Coppola, D. Huff, F. Wang et al. · 2007 · 135 citations

Engineering, Mechanical Engineering, Device Packages +20

SiC Wirebond Multichip Phase-Leg Module Packaging Design and Testing for Harsh Environment

Puqi Ning, Rixin Lai, D. Huff et al. · IEEE Transactions on Power Electronics · 2009 · 104 citations

Sic Devices, Engineering, Mechanical Engineering +22

Reliability of high temperature solder alternatives

F. Patrick McCluskey, Manas Ranjan Dash, Zhiguo Wang et al. · Microelectronics Reliability · 2006 · 91 citations

Reliability, Electrical Engineering, Reliability Engineering +9

Influence of collars on the primary stability of cementless femoral stems: A finite element study using a diverse patient cohort

Rami Al‐Dirini, D. Huff, Zhang Ju et al. · Journal of Orthopaedic Research® · 2017 · 38 citations · Full text

The impact of hip implant alignment on muscle and joint loading during dynamic activities

Casey A. Myers, Peter J. Laz, Kevin B. Shelburne et al. · Clinical Biomechanics · 2018 · 36 citations · Full text

Hip Implant Alignment, Kinesiology, Biomechanics +13