Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules

L. Coppola, D. Huff, F. Wang, +2

EngineeringMechanical EngineeringDevice PackagesPower Electronic SystemsPower Electronics +18

SiC Wirebond Multichip Phase-Leg Module Packaging Design and Testing for Harsh Environment

Puqi Ning, Rixin Lai, D. Huff, +4

IEEE Transactions on Power Electronics

Sic DevicesEngineeringMechanical EngineeringThermal ReliabilityThermal Properties +20

Reliability of high temperature solder alternatives

F. Patrick McCluskey, Manas Ranjan Dash, Zhiguo Wang, +1

Microelectronics Reliability

ReliabilityElectrical EngineeringReliability EngineeringEngineeringHardware Reliability +7

Influence of collars on the primary stability of cementless femoral stems: A finite element study using a diverse patient cohort

Rami Al‐Dirini, D. Huff, Zhang Ju, +3

Journal of Orthopaedic Research®

The impact of hip implant alignment on muscle and joint loading during dynamic activities

Casey A. Myers, Peter J. Laz, Kevin B. Shelburne, +5

Clinical Biomechanics

Hip Implant AlignmentKinesiologyBiomechanicsJoint LoadingDynamic Activities +11

Dimple-array interconnect technique for packaging power semiconductor devices and modules

Shuang Wen, D. Huff, Guo‐Quan Lu

3D Ic ArchitectureElectrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors) +12

Virtual trial to evaluate the robustness of cementless femoral stems to patient and surgical variation

Rami Al‐Dirini, Saulo Martelli, Dermot O’Rourke, +5

Journal of Biomechanics

Surgical VariationHip ArthroplastyBiomechanicsOsteoarthritisSurgery +8

Biomechanical Robustness of a Contemporary Cementless Stem to Surgical Variation in Stem Size and Position

Rami Al‐Dirini, Dermot O’Rourke, D. Huff, +2

Journal of Biomechanical Engineering

Tissue EngineeringBiomechanical RobustnessEngineeringCorail StemMovement Biomechanics +20

Thermal performance and microstructure of lead versus lead-free solder die attach interface in power device packages

Kelly L. Stinson-Bagby, D. Huff, D.C. Katsis, +2

EngineeringLead-free SolderPower ElectronicsAdvanced Packaging (Semiconductors)Thermal Analysis +15

SiC Wirebond Multi-Chip Phase-Leg Module Packaging Design and Testing for Harsh Environment

Puqi Ning, Rixin Lai, D. Huff, +2

Thermo-mechanical Reliability EvaluationElectrical EngineeringSic DevicesEngineeringHigh Junction Temperature +13