SiC Wirebond Multichip Phase-Leg Module Packaging Design and Testing for Harsh Environment

Abstract

<para xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> In order to take full advantage of SiC, a high-temperature wirebond package for multichip phase-leg power module using SiC devices was designed, developed, fabricated, and tested. The details of the material comparison and selection are described, thus culminating a feasible solution for high-temperature operation. A thermal cycling test with large temperature excursion (from <formula formulatype="inline"><tex Notation="TeX">$-$</tex></formula>55 <formula formulatype="inline"><tex Notation="TeX">$^{\circ}$</tex></formula>C to 250 <formula formulatype="inline"><tex Notation="TeX"> $^{\circ}$</tex></formula>C) was carried out to evaluate the thermomechanical reliability of the package. During the test, the substrate failed before other parts in 20 cycles. A sealing edge approach was proposed to improve the thermal reliability of the substrate. With the strengthening of the sealing material, the substrate, die-attachment, and wirebond assemblies exhibited satisfactoriness in the thermomechanical reliability tests. In order to evaluate the high-temperature operation ability of designed package, one prototype module was designed and fabricated. The high-temperature continuous power test shows that the package presented in this paper can perform well at 250 <formula formulatype="inline"><tex Notation="TeX">$^{\circ}$</tex></formula>C junction temperature. </para>