F. Patrick McCluskey

Publications

620

Citations

H-Index

1989

Active since

Affiliations

University of Maryland, College Park(Current)

DEVCOM Army Research Laboratory

AT&T (United States)

Virginia Tech

ABB (Switzerland)

F. Patrick McCluskey is an author at University of Maryland, College Park specializing in engineering, electrical engineering, and electronic packaging.

Top concepts

EngineeringElectrical EngineeringElectronic PackagingMicroelectronicsMaterial ScienceThermal EngineeringHeat TransferReliability EngineeringReliabilityMechanical Engineering

Publications per year

1989–2020

Publications

Reliability of high temperature solder alternatives

F. Patrick McCluskey, Manas Ranjan Dash, Zhiguo Wang et al. · Microelectronics Reliability · 2006 · 91 citations

Reliability, Electrical Engineering, Reliability Engineering +9

Temperature Cycling Reliability of High-Temperature Lead-Free Die-Attach Technologies

Pedro O. Quintero, F. Patrick McCluskey · IEEE Transactions on Device and Materials Reliability · 2011 · 68 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Constitutive Relations of Indium in Extreme-Temperature Electronic Packaging Based on Anand Model

Rui Chang, F. Patrick McCluskey · Journal of Electronic Materials · 2009 · 45 citations

Materials Science, Materials Engineering, Electrical Engineering +13

Reliability assessment of indium solder for low temperature electronic packaging

Rui Chang, F. Patrick McCluskey · Cryogenics · 2009 · 43 citations

Reliability, Electrical Engineering, Reliability Engineering +9

Transient liquid phase sintered attach for power electronics

Hannes Greve, Liangyu Chen, Ian M. Fox et al. · 2013 · 27 citations

Materials Science, High Temperature Attachment, Electrical Engineering +13

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